芯片电容器
1.1 概述 Overview1.1.1 产品的特性 Features随着无线技术的迅速发展,工作频率的不断升高,对元器件的小型化要求越来越高。由于芯片电容器具有以下特点,因此该产品非常适合对频率、便携性要求高的无线应用领域。With the raid advancements in wireless technology ,greater emphasis is being placed o
1.1 概述 Overview1.1.1 产品的特性 Features随着无线技术的迅速发展,工作频率的不断升高,对元器件的小型化要求越来越高。由于芯片电容器具有以下特点,因此该产品非常适合对频率、便携性要求高的无线应用领域。With the raid advancements in wireless technology ,greater emphasis is being placed o
1.1 概述 Overview
1.1.1 产品的特性 Features
随着无线技术的迅速发展,工作频率的不断升高,对元器件的小型化要求越来越高。由于芯片电容器具有以下特点,因此该产品非常适合对频率、便携性要求高的无线应用领域。
With the raid advancements in wireless technology ,greater emphasis is being placed on the working frequency and the miniaturization of the components . The Capacitors are an excellent choice for wireless applications benefited from the following features .
u 陶瓷介质,强度高,耐高温
Ceramic dielectrics ,high dielectric strength ,high temperature resistance
u 结构简单(MIM电容器结构),性能稳定可靠
Robust simple structure ( MIM Capacitor)
u 多种金属体系可选择,适合微组装工艺(如金丝键合)
Multiple metal system options , fit to micro-assembly such as gold bonding
u 适合Au/Sn、 Au/Si、 Au/Ge 共晶焊,以及导电胶粘连
Fit to Au/Sn、 Au/Si、 Au/Ge eutectic , epoxy attachment method
u 低温度变化率、低损耗、高Q值
Ultra stable with temperature , low dissipative losses , extremely high Q
1.1.2产品运用 Applications
u 耦合(隔直)电容 DC Block(coupling)
耦合隔直用电容作用是把射频能量从电路的一部分转移到另一部分,能量损失最小。
Capacitors used in coupling and dc blocking applications serve to couple RF energy with the minimal energy wasting from one part of a circuit to another.
u 旁路电容(去耦)Bypass (decoupling)
旁路电容的作用是提供一条低阻抗射频接地通道,旁路电容越多,其可靠性越差。
Capacitors with low impedance used in bypass application serve to carry RF energy from a specific point the circuit to the ground . The more the number of the capacitors used
in bypass application are , the worse the reliability of the circuit becomes.
u 匹配电容
匹配电容是用来实现信号传输线路上,阻法满足特定要求(如50欧姆系统匹配)而设计的电容。
The impedance matching application is to use the capacitors to provid the required impedance at a point in a circuit.
2.1.3基本参数 Basic Parameters
u 标称电容量 Nominal Capacitance
² 测量温度 Testing Temperature:25±3℃
² 测量信号 Testing Signal:1Vrms, 1MHz(Cp≤100pF)或or 1KHz(Cp>100pF)
² 容量标识 Capacitance Representation
电容量的标识一般采用三个字符来表示容量。字母R代表小数点的位置,如果三位字符均为数字时,末尾数字代表0的个数。
Three characters are used to denote the capacitance . The letter R represents the location of the decimal point . If the three characters are all figures , the last figure represents the count of the zero .
e.g.3R5=3.5pF, 0R5=0.5pF,470=47pF,102=1000pF
u 电容量精度 Capacitance Tolerance
相对标称值允许的误差,以%表示;小容量时,以±⊿C表示。
The allowable tolerance relative to nominal capacitance used in % for larger capacitance and ±⊿C for little capacitance.
★ TABLE 2-1容量精度代码表Capacitance tolerance code
代码 | A | B | C | D | F | J | K | L | M | O | Z | V |
精度 | ±0.05pF | ±0.1pF | ±0.25pF | ±0.5pF | ±1% | ±5% | ±10% | ±15% | ±20% | ±40% | -20%,+80% | 0% +100% |
u 工作电压 DC Working Temperature
确保电容器长期安全运作的电压
The working voltage can ensure safe work for long term of the capacitor.
u 绝缘电阻 IR
测量条件 Testing Condition:工作电压 Operating Voltage ,5-30s
最小绝缘电阻Min IR:请参见陶瓷介质表Listed on EIELETRIC TABLE,P4
u 介质损耗DF
测量温度 Testing Temperature:25±3℃
测量信号 Testing Signal:1Vrms, 1MHz(Cp≤100pF)或or 1KHz(Cp>100pF)
损耗范围DF Range:请参见陶瓷介质表Listed on EIELETRIC TABLE,P4
u 工作温度范围 Working temperature range:-55℃-+125℃
u 电容温度系数或电容量变化率Temperature Coefficient or Rate of Temperature Change:
在工作温度范围内,电容量变化以25℃为基准。
The capacitance change an be determined by measurement of the capacitance change at various temperatures from reference room temperature (25℃)within the operating temperature range.
1.1.4陶瓷介质Ceramic dielectric
u 陶瓷介质表 DIELECTRIC TABLE TABLE 2-2
介质种类 | 介电常数 | 温度系数 | 损耗最大值 | 绝缘电阻最小值 | |
一类瓷 | 20 | 0±30ppm | C0G | 0.0015 | 1012 |
40 | 0±30ppm | C0G | 0.0015 | 1012 | |
80 | 0±30ppm | C0G | 0.0015 | 1012 | |
100 | 0±60ppm | C0H | 0.0025 | 1012 | |
130 | -750±500ppm | U2L | 0.003 | 1012 | |
300 | -2200±500ppm | R3L | 0.007 | 1011 | |
600 | -3300±500ppm | S3L | 0.012 | 1011 | |
900 | -4700±1000ppm | T3M | 0.012 | 1011 | |
二类瓷 | 2500 | ±15% | X7R | 0.04 | 1011 |
4000 | ±15% | X7R | 0.04 | 1011 | |
9000 | ﹢22%,-82% | Y5V | 0.04 | 1011 | |
三类瓷 | 15000 | ±15% | X7R | 0.025 | 109 |
25000 | ±15% | X7R | 0.025 | 109 | |
35000 | ±15% | X7R | 0.025 | 109 |
注:C≤100 pF时,电容量及损耗的测试频率为1MHz;C>100 pF时,电容量及损耗的测试频率为1KHz。
apacitor
2.2.1特性 Features
u 最高使用频率 Max Working frequency:100GHz
u 最小尺寸 Min Size:0.200mm×0.200mm
u 容量范围 Capacitance range: 0.2pF-10000pF
u 工作温度范围 Working temperature range:-55℃-+125℃
1.2.2外型结构 Type
★ TABLE2-5电容产品代码 Type code
1.2.3产品编号 Part Number Code
产品代码 | 尺寸 | 温度系数 | 容量 | 精度 | 额定工作电压 | 镀层体系 | 包装方式 |
HA:不留边电容 HB:单面留边电容 | 1515 2020 3030 | C0G X7R X7S Y5V | 1R5 101 102 | J K M | 016:16V 025:25V 050:50V 100:100V | W:TiW/Au N:TiW/Ni/Au T:TaN/TiW/Au F:TaN/TiW/Ni/Au | L:蓝膜 T:盒装 |
1.2.4选型指导 Selection Guide
★ 常用规格型号推荐表 Recommended Table for Common Specifications
尺寸代码 | 1010 | 1515 | 2020 | 2525 | 3535 | 5050 | 7070 | 9090 |
尺寸(mm) | 0.254×0.254 (±0.051) | 0.381×0.381 (±0.076) | 0.508×0.508 (±0.076) | 0.635×0.635 (±0.127) | 0.889×0.889 (±0.127) | 1.27×1.27 (±0.254) | 1.78×1.78 (±0.254) | 2.29×2.29 (±0.254) |
容值(pF) | 产品规格型号 | |||||||
0.3 | HA1010C0H 0R3B100TT | |||||||
0.8 | HB1515C0H 0R8C100TT | |||||||
1.0 | HA1010R3L 1R0C100TT | HB2020C0G 1R0C100TT | ||||||
1.8 | HB1515R3L 1R8C100TT | HB2525C0G 1R8C100TT | ||||||
2.0 | HB1515R3L 2R0C100TT | |||||||
3.0 | HB3535C0G 3R0C100TT | |||||||
3.3 | HB2020R3L 3R3D100TT | |||||||
3.9 | HA1515S3L 3R9D100TT | |||||||
4.3 | HA1515S3L 4R3D100TT | HB3535C0H 4R3D100TT | ||||||
4.7 | HA1515S3L 4R7D100TT | |||||||
5.1 | HA1515S3L 5R1D100TT | |||||||
6.8 | HB15156R8 T3MD100TT | HB2020S3L 6R8D100TT | ||||||
8.2 | HA1010X7R 8R2M100TT | HB2020S3L 8R2M100TT | ||||||
10 | HA1010X7R 100M100TT | HB2020T3M 100M100TT | HB2525S3L 100M100TT | HB3535R3L 100M100TT | ||||
18 | HB2525T3M 180M100TT | |||||||
20 | HB1515X7R 200M100TT | |||||||
22 | HB1515X7R 220M100TT | HB3535S3L 220M100TT | ||||||
27 | HB1515X7R 270M100TT | HB2020X7R 270M100TT | ||||||
33 | HB2020X7R 330M100TT | HB3535T3M 330M100TT | ||||||
39 | HB2020X7R 390M100TT | |||||||
42 | HB2020X7R 420M100TT | HB2525X7R 420M100TT | ||||||
47 | HB2020X7R470M100TT | HB2525X7R 470M100TT | ||||||
50 | HB2020X7R500M100TT | HB2525X7R 500M100TT | ||||||
56 | HA1010X7R 560M050TT | |||||||
68 | HA1010X7R 680M050TT | HB2525X7R 680M100TT | ||||||
100 | HA1010X7R 101M025TT | HB1515X7R 101M050TT | HB2020Y5V 101M100TT | HB2525X7R 101M100TT | HB3535X7R 101M100TT | |||
120 | HB1515X7R 121M050TT | HB3535X7R 121M100TT | ||||||
150 | HB1515X7R 151M050TT | |||||||
200 | HB1515X7R 201M050TT | |||||||
220 | HB1515X7R 221M050TT | |||||||
300 | HB1515X7R 301M025TT | HB2020X7R 301M050TT | ||||||
330 | HB1515X7R 331M025TT | HB2020X7R 331M050TT | ||||||
470 | HB2525X7R 471M050TT | |||||||
680 | HB2525X7R 681M025TT | HB3535X7R 681M050TT | ||||||
1000 | HB3535X7R 102M050TT | |||||||
2200 | HB5050X7R 222M050TT | |||||||
3000 | HB7070X7R 302M025TT | |||||||
10000 | HB9090X7R 103M025TT |
1.3表面贴装型芯片电容器Series Chip Capacitors
1.3.1特性 Features
u 最高使用频率 Max working frequency:40GHz
u 表面贴装型,免除金丝键合 SMT mode capacitor ,avoid wire bonding
u 容量范围 Capacitance range:0.01pF-2000pF
u 工作温度范围 Working temperature range:-55℃-+125℃
2.3.2外形结构、等效电路图、安装示意图
Type mode ,Equivalent schematic circuit and Mounting Diagram
1.3.3产品编号 Part Number Code
产品代码 | 尺寸 | 温度系数 | 容量 | 精度 | 额定工作电压 | 镀层体系 | 包装方式 |
HC:表面贴装型电容 | 0402 0603 0805 | C0G X7R X7S Y5V | 101 1R5 102 | J K M | 016:16V 025:25V 050:50V 100:100V | W:TiW/Au N:TiW/Ni/Au T:TaN/TiW/Au F:TaN/TiW/Ni/Au | L:蓝膜 T:盒装 |
2.3.4选型指导 Selection Guide
★ TABLE2-7 常用规格型号推荐表 Recommended Table for Common Specifications
尺寸代码 | 0201 | 0402 | 0603 | 0805 | 1206 |
长度(mm) | 0.508±0.076 | 1.016±0.127 | 1.52±0.127 | 2.032±0.254 | 3.048±0.254 |
宽度(mm) | 0.254±0.051 | 0.508±0.127 | 0.762±0.127 | 1.27±0.127 | 1.524±0.127 |
间隙(mm) | 0.106±0.05 | 0.106±0.05 | 0.152±0.05 | 0.203±0.076 | 0.203±0.076 |
推荐型号 | HC0201T3M1R1C100TT | HC0402S3L3R3M050TT | HC0603R3L3R9M100TT | HC0805R3L100M100TT | HC1206R3L200M100TT |
HC0201X7R4R7M100TT | HC0402X7R140M100TT | HC0603X7R470M100TT | HC0805X7R101M100TT | HC1206T3M680M100TT | |
HC0201Y5V100M100TT | HC0402X7R200M100TT | HC0603X7R221M050TT | HC0805X7R471M100TT | HC1206X7R221M100TT | |
HC0201X7R330M050TT | HC0402X7R101M050TT | HC0603X7R331M050TT | HC0805X7R681M050TT | HC1206X7R102M050TT |
1.4 阵列型芯片电容器 Multiple Value Chip Capacitors
1.4.1 特性 Features
u 降低芯片贴装面积 Reduce capacitor mounting area
u 降低成本 Reduce costs
u 单容量范围 Single capacitance range:0.1pF-1000pF
u 工作温度范围 Working temperature range:-55℃-+125℃
1.4.2 外形结构及等效电路图 Type mode ,Equivalent schematic circuit
1.4.3产品编号 Part Number Code
产品代码 | 尺寸 | 温度系数 | 容量 | 精度 | 额定工作电压 | 镀层体系 | 包装方式 |
HD:阵列型电容 | 15 03 25 04 25 06 | C0G X7R X7S Y5V | 101 1R5 102 | J K M | 016:16V 025:25V 050:50V 100:100V | W:TiW/Au N:TiW/Ni/Au T:TaN/TiW/Au F:TaN/TiW/Ni/Au | L:蓝膜 T:盒装 |
注:此款产品尺寸代码为四位,前两位为产品宽度代码,后两位为产品电极数;如2506 表示此产品宽度为25(0.635mm),长度方向有6个电极。
1.4.4选型指导 Selection Guid
★ TABLE 2-8 常用规格型号推荐表 Recommended Table for Common Specifications
宽度代码 | 15 | 20 | 25 | 35 | ||
电极数 | 电极尺寸(mm) | 宽度(mm) | 0.381±0.076 | 0.508±0.076 | 0.635±0.127 | 0.889±0.127 |
长度(mm) | 推荐型号 | |||||
3 | 0.381±0.127 | 1.651±0.127 | HD1503X7R220Z100TT | HD2003X7R330Z100TT | HD2503X7R470Z100TT | HD3503X7R680Z100TT |
4 | 0.381±0.127 | 2.159±0.254 | HD1504Y5V680Z100TT | HD2004Y5V800Z100TT | HD2504Y5V101Z100TT | HD3504Y5V151Z100TT |
5 | 0.381±0.127 | 2.667±0.254 | HD1505X7R101Z050TT | HD2005X7R121Z050TT | HD2505X7R221Z050TT | HD3505X7R471Z050TT |
6 | 0.381±0.127 | 3.175±0.381 | HD1506X7R201Z050TT | HD2006X7R251Z050TT | HD2506X7R331Z050TT | HD3506X7R681Z050TT |